TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...
Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.
Unimicron Technology said AI-related products will account for more than 30% of its 2025 revenue and could surpass 40% in 2026. However, near-term profitability is under pressure...
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Strong demand for artificial intelligence (AI) applications has driven a significant rise in GB200 and ASIC shipments, propelling revenue growth across both upstream and downstream...
The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Taiwan's government has instructed leading industrial research institutions, such as the Industrial Technology Research Institute (ITRI), the Metal Industries Research and Development...
Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from Nvidia but also sees Apple joining the fray, clearly signaling...
Hota Industrial Manufacturing chairman David Shen is navigating a series of market variables, from tariffs to exchange rates. While Hota has been largely unaffected by tariffs, the...
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
