Despite ongoing uncertainties in the global market, including tariffs and consumer electronics conditions, TSMC chairman C.C. Wei stated that no significant changes in client behavior...
Dutch lithography equipment giant ASML announced it will release its second quarter 2025 earnings report at 2 pm Taiwan time on July 16, one day ahead of TSMC. A major concern for...
Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker's three largest global manufacturing...
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...
Kurt Sievers, the CEO of Dutch semiconductor giant NXP Semiconductors, who is set to officially step down at the end of October 2025, recently visited Shanghai and met with the mayor...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Beijing E-Town Semiconductor Technology Co., Ltd. (E-Town), a Chinese supplier of semiconductor manufacturing equipment, went public on the Shanghai STAR Market on July 8, 2025. The...
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
On June 13, 2025, Jiangsu Advanced Memory Semiconductor Co., Ltd. (AMS) announced that its restructuring plan had been abandoned. The planned investment from Huaxin Jiechuang Integrated...
Infineon Technologies AG has announced progress in its scalable gallium nitride (GaN) semiconductor manufacturing using 12-inch wafers, aiming to supply customer samples by the fourth...
Recent supply chain rumors have indicated that TSMC will withdraw from the gallium nitride (GaN) market, a third-generation semiconductor material, with related production lines at...
The leading third-generation semiconductor silicon carbide (SiC) supplier, US-based Wolfspeed, has filed for bankruptcy reorganization. Its major creditors recently reached a restructuring...
China is poised to overtake Taiwan as the world's top semiconductor foundry hub by 2030, according to Yole Group. With 21% of global capacity in 2024 and rapid domestic expansion...
