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Tuesday 15 August 2023
Samsung reveals current situation and challenges of BSPDN, a key technology in the 2nm race
As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...
Thursday 27 July 2023
Samsung reportedly investing in R&D for 3D stacking GAA technology
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...