Luxembourg-based satellite telecom operator OQ Technology is testing investor appetite for space-based Internet of Things (IoT) technology, seeking EUR 30 million in fresh funding...
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
Motorola, under Lenovo's ownership, is accelerating its efforts in the smartphone market as it integrates AI capabilities across its product lineup. Luca Rossi, Lenovo's executive...
Dekra, the world's largest independent testing, inspection, and certification organization, officially opened its new Taiwan headquarters in Linkou, New Taipei City, on October 23,...
As Nvidia shares its finalized GB200 infrastructure design specifications with the industry, suppliers are gearing up for increased competition focused on quality, compatibility,...
In the past, when LG Display (LGD) supplied OLED panels for Apple's iPhone series, the display driver ICs (DDI) were exclusively produced by LX Semicon. However, 2024 saw Novatek...
The ongoing surge in generative AI is propelling demand for advanced testing technologies, with leading testing interface providers Winway and MPI reporting impressive financial results...
A growing number of companies are adopting digital twin technology to build highly accurate virtual models that mirror the real world, offering the automotive industry a new solution...
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Taiwan-based IC distributor Macnica Anstek has experienced a significant increase in order and shipment volume for its main distribution lines, driving sales performance in the third...
Malaysia's local assembly and testing industry has evolved into a mature ecosystem that extends beyond Penang. However, the country is experiencing growing concerns about upgrading...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
