Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
The global semiconductor industry is experiencing steady growth, driven by advances in wafer processing and packaging technologies. In line with this trend, Tongtai Machine &...
Suzhou Everbright Photonics is betting on explosive demand from artificial intelligence (AI) and data centers to drive future growth, Chairman Dayong Min said in an interview with...
Former Alphabet Inc. CEO Eric Schmidt secretly visited Taiwan in 2025 with a primary focus on scouting AI talent for the US Democratic Party during the presidential election campaign,...
Taiwanese drone manufacturer Thunder Tiger announced it will launch its latest 6-meter-class unmanned surface vessel (USV), the SeaShark 600 Stealth, at next week's 2025 Taipei Aerospace...
Samsung Electronics has continued to demonstrate its resilience in its Taiwan operations in 2025, even in the face of tariffs, inflation, and geopolitical risks. The company saw sustained...
The semiconductor landscape has fundamentally shifted. As we move from 2025 to 2026, three forces dominate global technology discourse: semiconductors, artificial intelligence, and...
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply...
The rising wave of artificial intelligence (AI) is driving the growing importance of high-bandwidth memory (HBM), which has become a core component of AI system architectures. The...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Taiwan's Compal Electronics has announced a strategic collaboration with US-based ZutaCore, a leader in waterless direct chip liquid cooling, to bring transformative cooling technology...
At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...
NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
