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NEWS TAGGED TEARDOWN
Friday 28 September 2018
iPhone XS Max costs Apple US$20 more in materials than iPhone X, says IHS
The teardowns and cost benchmarking team at IHS Markit has completed its preliminary physical review of the new iPhone XS Max. The model A1921 version of the smartphone sold in North...
Tuesday 3 April 2018
GigaDevice chips adopted for new Samsung flagship phone, says report
China-based NOR flash memory firm GigaDevice Semiconductor has entered the supply chain for Samsung's new flagship smartphone with its serial flash chips, according to a report by...
Friday 23 March 2018
Galaxy S9+ materials cost US$43 more than previous versions, says IHS Markit
The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
Thursday 9 November 2017
iPhone X costs Apple US$370 in materials, says IHS Markit
Teardown engineers at IHS Markit have completed their preliminary physical dissection of the new Apple iPhone X and found that the model A1865 version of the smartphone with 64GB...
Tuesday 26 September 2017
Apple iPhone 8 Plus carries over US$280 BOM, IHS teardown reveals
The new Apple iPhone 8 Plus, equipped with 64GB of NAND flash memory, carries a bill of materials (BOM) cost that comes out to US$288.08, higher than any previous versions of the...
Monday 24 April 2017
Galaxy S8 materials costs highest by far compared to previous versions, IHS teardown reveals
The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions...
Thursday 7 April 2016
iPhone SE is 3 iPhone generations rolled into 1, IHS teardown reveals
A preliminary estimate by IHS and its teardown and cost benchmarking service shows that the iPhone SE smartphone costs about US$160 to build. The US version of an entry-level iPhone...
Thursday 17 March 2016
Samsung Galaxy S7 teardown reveals ho-hum refresh, says IHS
A preliminary estimate by IHS shows that the Samsung Galaxy S7 smartphone costs about US$255 to build. The US version of the Galaxy S7 with 32GB of NAND memory carries a bill of materials...
Friday 8 May 2015
New Apple Watch has lowest ratio of hardware costs to retail price, IHS teardown reveals
The Apple Watch has the lowest hardware costs compared to retail price of any Apple phone IHS Technology has researched, according to a preliminary estimate by IHS. The teardown of...
Wednesday 15 April 2015
Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus, says IHS
The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a...
Thursday 25 September 2014
Commentary: Few Taiwan-made IC parts in iPhone 6
A recent teardown of the iPhone 6 showed that Apple still prefers to use IC parts offered by leading international players, excluding most Taiwan-based IC design houses for the supply...
Wednesday 14 May 2014
Google Glass far more than the sum of its parts, IHS teardown reveals
Teardown analysis is a useful tool for understanding the component and manufacturing cost of electronics devices – but it does not always tell the whole story of the value of...
Wednesday 16 April 2014
Samsung Galaxy S5 carries over US$250 BOM, IHS teardown reveals
The Samsung Galaxy S5 with 32GB of NAND flash memory carries a BOM of US$251.52, according to IHS. The cost rises to US$256.52 when the US$5 manufacturing cost is added.
Thursday 28 November 2013
Microsoft Xbox One hardware cost comes in below retail price, IHS teardown reveals
Microsoft's new Xbox One carries a bill of materials (BOM) of US$457, according to preliminary results from IHS' teardown analysis service. Manufacturing is estimated at US$14, which...
Thursday 26 September 2013
Apple iPhone 5s carries US$199 BOM and manufacturing cost, IHS says
Apple's new flagship product- the iPhone 5s- features some cutting-edge components that represent pioneering achievements for the smartphone market while maintaining a nearly identical...
Jul 23, 10:33
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
Tuesday 13 July 2021
MOBI standards guide innovation in blockchain services for growth in smart mobility industry
Wednesday 7 July 2021
ADLINK helping manufacturers upgrade businesses with private 5G network-enabled smart manufacturing solutions
Wednesday 7 July 2021
Coretronic leverages strengths to enable smart manufacturing
TSMC dossier (8): Can China establish leadership in semiconductor sector?
Mitac sees 52-week lead time for server component deliveries
Is GF a good buy for Intel?
Chip probing houses to gain from new iPhone SE series, say sources
Intel GF buyout unlikely, sources say
Google, VW, Toyota keen to develop car operating systems
Bluetooth LBS apps getting popularity for COVID tracking, says Digitimes Research
Development of on-device AI chips for smart speakers gaining momentum
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