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NEWS TAGGED TEAM GROUP
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Thursday 17 June 2021
Memory module firms gearing up for new-gen DDR5 product rollouts
Memory module firms including Kingston Technology, Adata Technology, Apacer Technology and Team Group all plan to launch their new-generation DDR5 memory series in the second half...
Wednesday 26 May 2021
Memory module makers cautiously optimistic about demand from Chia
Memory module houses have seen their sales driven by the mounting mining fever for new cryptocurrency Chia in the second quarter of 2021, but are unsure whether it is sustainable,...
Tuesday 18 May 2021
Memory module makers continue stockpiling
Memory chipmakers continue to see their downstream module and device customers stockpile, while experiencing tight fab capacity, according to industry sources in Taiwan.
Monday 10 May 2021
Memory modules makers post handsome revenue gains in April
Taiwan's memory modules specialist Team Group saw its SSD shipments for April surge over 70% on year, driven the rapidly mounting mining fever for new cryptocurrency Chia, and expects...
Thursday 22 April 2021
ChipMOS to expand backend capacity for memory chips
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Thursday 1 April 2021
Team Group posts profit hike on record revenue in 2020
Memory module house Team Group saw its net profit jump more than tenfold on year to NT$141 million (US$5 million) in 2020, with revenue hitting a record high of NT$7.5 billion. EPS...
Friday 12 March 2021
DRAM probe card demand ramping up
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Wednesday 27 January 2021
DDR5 ready for consumer electronics products as early as 2H21
Next-generation DDR5 memory is expected to be employed in consumer electronics devices starting as early as the second half of 2021, despite its still-early stage of deployment, according...
Tuesday 29 December 2020
Team Group to put increased focus on gaming, industrial in 2021
Team Group will put increased focus on the gaming and industrial control segments in 2021, when market conditions will be also favorable to the memory module maker, according to the...
Monday 16 November 2020
Team Group reports loss in 3Q20
Memory module house Team Group swung to net loss of approximately NT$70 million (US$2.46 million) in the third quarter, due mainly to an around 10% fall in memory ASPs, as well as...
Monday 7 September 2020
QLC SSD demand to boom for both enterprise and consumer applications
With major chipmakers ramping up their quad-level cell (QLC) NAND flash output, SSDs utilizing the technology storing four bits per cell have become commercially available and are...
Monday 17 August 2020
Memory prices to fall 10% in 4Q20
Prices of memory chips, including DRAM and NAND flash, are expected to fall 10% sequentially in fourth-quarter 2020 with the downward spiral likely to continue into the first half...
Wednesday 15 July 2020
Memory module firms look to gaming, creator PCs for 2H20 growth
Gaming products and creator-focused notebooks will be driving several memory module makers' revenue growth in the second half of 2020, according to industry sources.