中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
PnP Summit
TSMC
AI Search
NTN Convergence
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
CSP capex surge fuels hot AI server demand and tight supply in 2026
ICT
8min ago
Acer sees CPU shortages worse than memory as 2H24 PC market weakens
Tomorrow's Headlines
May 26, 18:10
Grab bets on agentic AI to reshape Taiwan's food delivery market with foodpanda acquisition
Tomorrow's Headlines
May 26, 18:10
Huawei’sTau Law breath new air into China's advanced packaging
Tomorrow's Headlines
May 26, 17:50
Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
Tomorrow's Headlines
May 26, 17:50
Google and Blackstone form AI cloud venture to commercialize TPU capacity
Tomorrow's Headlines
May 26, 17:50
Taiwan's SAS breaks out of China's low-price solar trap with space, drone, and marine applications
Tomorrow's Headlines
May 26, 17:50
Intel 18A yield gains raise pressure on Samsung foundry
Tomorrow's Headlines
May 26, 17:50
NEWS TAGGED SPRINGSOFT
Tuesday 11 November 2008
SpringSoft signs EDA deal with Silicon Valley Technical Institute
Taiwan-based software provider SpringSoft has announced that the Silicon Valley Technical Institute (SVTI) has chosen SpringSoft's Laker custom layout system for use in its technical...
2/2
pages
1
2
BIZ FOCUS
Apr 28, 08:00
AI anti-fraud solution wins virtual asset security hackathon
Monday 27 April 2026
SK hynix receives 2026 IEEE Corporate Innovation Award
Monday 27 April 2026
Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
Friday 24 April 2026
NewPower Named HPE 2026 Partner of the Year
MOST-READ
7 DAYS NEWS
SK Hynix speeds Yongin fab buildout as memory crunch fuels capacity race
AMD's 2nm defection to Samsung dents TSMC's AI grip
Memory supply gap stretches beyond 2028 as cloud capex tops US$725 billion
Intel's revival secret: Suppliers with TSMC's stamp of approval
TSMC CoWoS yields top 98% as capacity expands
TSMC CEO to address bonus backlash in person as Jensen Huang's visit puts Taiwan chipmaker in spotlight
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
TSMC and Micron's fabs expanding; how do Samsung and SK Hynix's bonus systems come into play?
SK Hynix seeks to embed cooling inside HBM to beat the heat
China tightens drone, flying-car rules as low-altitude market takes off
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first