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Friday 23 January 2026
Analysis: How Howard Lutnick is redrawing the memory-chip map

US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

Friday 23 January 2026
South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme ultraviolet (EUV) photomask pellicle-related equipment for its Taylor fab with South...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Thursday 22 January 2026
How Sony-TCL tie-up could chip away at Samsung's OLED advantage

Sony's decision to form a TV joint venture with TCL is being read in South Korea less as a routine corporate reshuffle than as a structural...

Thursday 22 January 2026
Kioxia warns of tight NAND supply through 2027

Kioxia, the world's third-largest manufacturer of NAND flash memory, has largely exhausted its production capacity for the current year...

Thursday 22 January 2026
Lutnick warns memory chipmakers may face 100% tariffs without US production

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market...

Wednesday 21 January 2026
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked...

Wednesday 21 January 2026
South Korea plans US talks as chip tariffs heighten risks for Samsung, SK Hynix
South Korea said it will seek negotiations with the US after Washington imposed a 25% tariff on selected semiconductor products, a move that has placed the country's leading chipmakers,...
Wednesday 21 January 2026
China races to catch up with memory chip leaders in LPDDR6
China's semiconductor supply chain is accelerating plans to bring sixth-generation low-power DRAM, known as LPDDR6, into commercial use in 2026, seeking to close a long-standing technology...
Tuesday 20 January 2026
Samsung foundry utilization reportedly nears 60% as losses narrow
Samsung Electronics' foundry business is showing signs of a gradual recovery, with fab utilization expected to average in the low-60% range in the first half of 2026, up from the 50%...
Tuesday 20 January 2026
Nvidia Alpamayo sparks VLA computing power race as South Korea preps for autonomous ecosystem
At CES 2026 in the US, Nvidia unveiled its open-source vision-language-action (VLA) model series, Alpamayo, signaling a new phase in the development of autonomous driving technologies...
Tuesday 20 January 2026
Naver Cloud fails South Korea's AI foundation model selection
Based on the results of the first phase of South Korea's independent AI foundation model selection, LG AI Research, SK Telecom, and Upstage have advanced to the next stage. However,...
Tuesday 20 January 2026
Samsung Device Solutions eyes 47% bonuses after profit surge

Samsung Electronics on January 16 announced payout ratios for its 2025 excess profit performance incentive, with the Device Solutions...

Sunday 18 January 2026
South Korea signs IP pact again, China-linked tech leaks still dominate
South Korea's Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China's National Intellectual Property Administration...
Sunday 18 January 2026
SK Hynix accelerates advanced packaging from Korea to Indiana
SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...