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Tuesday 2 April 2024
South Korea's electricity tariff hike: business response?
South Korea's leading power utility, KEPCO, is poised to implement a hike in electricity tariffs following the parliamentary...
Tuesday 2 April 2024
Chinese SiC prices plummet amid production expansion and intensifying competition
Multiple Chinese media reported that prices of Silicon Carbide (SiC) substrate and epitaxy have fallen rapidly in recent months in China, as manufacturers from China and abroad are...
Monday 1 April 2024
Downsizing concerns return as LGD continues to struggle
LGD wants to use its resources more efficiently.
Monday 1 April 2024
Weekly news roundup: Leaked Huawei chipset details surface, revealing chips manufactured with SMIC 5nm process
These are the most-read DIGITIMES Asia stories in the week of March 25 – March 29.
Friday 29 March 2024
South Korea's semiconductor output rises by most in 14 years
South Korea's output of semiconductors jumped the most in 14 years in February in an indication of ongoing recovery in the country's most important industrial sector and global tech...
Friday 29 March 2024
CXL and HBM become key sections of Samsung's memory solution roadmap
Samsung Electronics recently disclosed its next-generation memory solution technology roadmap on Memory Con 2024.
Friday 29 March 2024
SK Hynix sees key DRAM opportunity in HBM customization
SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.
Friday 29 March 2024
Hyundai will invest KRW68 trillion to boost EV competitiveness
Hyundai Motor Group announced on March 27 that it aims to invest KRW68 trillion (US$51 billion) in South Korea until the end of 2026.
Friday 29 March 2024
SK Hynix to break ground for state-backed advanced Yongin memory fab in 1Q25
SK Hynix is slated to officially break ground in March 2025 for a new advanced memory plant in Yongin, South Korea.
Thursday 28 March 2024
Samsung expands AI ecosystem with Galaxy Ring, integrates AI food platform and appliances
Samsung Galaxy Ring, slated for potential release in the latter half of 2024, is expected to integrate with the company's AI-powered custom recipe platform, Samsung Food.
Thursday 28 March 2024
Samsung raises HBM shipping volume target, implying successful validation at Nvidia
Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...
Thursday 28 March 2024
OLED materials demand ramping up
Demand for OLED materials is ramping up for IT and AR/VR device applications, according to industry sources in South Korea.
Wednesday 27 March 2024
SK Hynix reportedly planning new packaging facility for HBM in the US
Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...
Wednesday 27 March 2024
South Korean Congress may fail to approve its Chips Act amendment before deadline
Tax incentives promised for South Korean semiconductor companies by its version of the Chips Act may fall through the fingers.
Tuesday 26 March 2024
Samsung to build fully automated fabs with Nvidia Omniverse platform
Samsung is building a virtual fab