Qualcomm is expected to significantly enhance its partnership with Taiwan Semiconductor Manufacturing Company (TSMC) for the production of high-performance computing (HPC) chips for...
Taiwan Semiconductor Manufacturing Company (TSMC) is set to tape out more than 50 chip designs with its 7nm process technology by the end of 2018, and over 100 chip designs with both...
Qualcomm Technologies has announced a family of 60GHz Wi-Fi chipsets, the QCA64x8 and QCA64x1, delivering 10+ gigabit-per-second (Gbps) network speeds and wire-equivalent latency.
Taiwan Semiconductor Manufacturing Company (TSMC) will start fabricating Qualcomm's next-generation Snapdragon 800 series SoC chips in the fourth quarter of 2018, according to a report...
Smartphone applications processors (AP) with on-device artificial intelligence (AI) functionality grew almost three fold year-on-year in the first quarter of 2018, Strategy Analytics...
Qualcomm has unveiled what the company claims is the world's first fully-integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and other mobile devices...
Speculation has been circulating that Qualcomm will return to TSMC for 7nm. Industry sources believe that the foundry with its 7nm FinFET process node will win back its major contract...
Sony Mobile Communications has launched its latest flagship smartphone, the Xperia XZ2 Premium, in the Taiwan market with the availability to begin in the second half of July. The...
HiSilicon Technologies, a Huawei smartphone solution subsidiary, is reportedly to launch its new mid-tier solution, the Kirin 710, in July and, as suggested by its product name, is...
At Computex, Qualcomm has announced at a joint effort with Samsung Electronics to integrate its Snapdragon 850 Mobile Compute Platform, featuring the Snapdragon X20 and Qualcomm AI...
The global smartphone applications processor (AP) market declined 5% on year to US$20.2 billion in 2017, while the tablet AP market grew 3% to US$2 billion, according to Strategy...
China smartphone vendors including Huawei, Oppo and Xiaomi have lately launched their respective 2018 flagship devices boasting high price-performance ratios and multiple smart functions,...
The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
MediaTek's recently-introduced Helio P60 mobile SoC that comes with AI capabilities has been adopted by Oppo and Meizu for their upcoming smartphone models, according to a report...
With the imminent commercialization of 5G mobile technologies and services, mobile chipset suppliers, telecom operators and related supply chains will all face the initial incorporation...
