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NEWS TAGGED SK HYNIX
Friday 13 June 2025
SK Hynix unveils 30-Year DRAM roadmap with Vertical Gate, 3D stack in bid to extend Moore's Law
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global...
Friday 13 June 2025
Micron reportedly clinches SOCAMM lead with Nvidia's greenlight
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
Friday 13 June 2025
Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Thursday 12 June 2025
SK Hynix warns of rockier 2H25, leans on multi-sourcing strategy
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong...
Wednesday 11 June 2025
SK Hynix weighs TCB suppliers: Hanmi, Hanwha face off for 2H25 HBM3E equipment orders
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
Tuesday 10 June 2025
SK Hynix presents future DRAM technology roadmap at IEEE VLSI 2025
SK Hynix Inc. (or "the company", www.skHynix.com) announced today that it presented a new DRAM technology roadmap for the next 30 years and the direction for a sustainable innovation...
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
Friday 6 June 2025
South Korea's new presidential tech vision: KRW9 trillion semiconductor boost for Samsung and SK Hynix
As Lee Jae-myung takes office as South Korea's 21st President, the global tech and industry community is closely monitoring his ambitious economic agenda. Among the key sectors under...
Thursday 5 June 2025
South Korea's Lee proposes 10% tax credit for domestic chip production
South Korea's newly elected President Lee Jae-myung has unveiled a flagship policy offering up to 10% production tax credits for semiconductors manufactured and sold domestically,...
Thursday 5 June 2025
CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
Thursday 5 June 2025
Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
Wednesday 4 June 2025
Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster...
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...