Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
As tech companies push the boundaries of next-generation edge AI devices like smart glasses, two major hurdles remain: weight and heat. These issues, often overlooked in a device's...
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
Taiwan is racing to advance its silicon photonics capabilities, aiming to develop high-efficiency 400Gbps optical modules within one to two years, according to the Ministry of Economic...
Cyient Semiconductors has entered a strategic partnership with US-based Anora, headquartered in Texas, to provide end-to-end semiconductor development solutions, from design to production...
Taiwan's integrated circuit (IC) design industry ranks second worldwide, trailing only the US. However, in recent years, Taiwan's position has become increasingly precarious due to...
Power semiconductors, particularly silicon carbide (SiC) and gallium nitride (GaN), emerged as key themes at SEMICON Taiwan 2025. The toughest competition was in SiC equipment, with...
A new phase in the global race for silicon carbide (SiC) dominance is unfolding—one shaped as much by geopolitics as by market forces. As Chinese manufacturers make rapid strides...
Wiwynn chair and chief strategy officer Emily Hong said that the company is collaborating with silicon photonics companies to address the rapid increase in AI computing power. As...
ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world's most influential semiconductor exhibitions. ACE Solution...
The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
