Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing...
The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel...
Micron Technology announced during its latest investor conference that its HBM4 development is progressing as planned while revealing development of HBM4E is underway. The company...
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in the US, cementing...
Samsung Display is advancing its microOLED technology by shifting from silicon wafers to glass substrates, a move aimed at improving production efficiency and reducing costs for AR/VR...
The world's third-largest NAND flash manufacturer, Kioxia, has officially gone public in Japan, securing funding for investments in artificial intelligence (AI) semiconductor technologies...
The competition for advanced logic processes at the 2-nanometer level will enter its production phase in 2025. Following their absence in the 5nm and 3nm generations, both Intel and...
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
