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Thursday 5 June 2025
Samsung loses key US memory architect to SanDisk as chip race escalates
Jim Elliott, a veteran executive who spent over 20 years leading Samsung Electronics' memory operations in the US, has reportedly exited the company to join rival NAND flash provider...
Thursday 5 June 2025
CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK...
Thursday 5 June 2025
Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
Thursday 5 June 2025
Samsung Foundry’s 2025 Forum signals shift in strategy
Samsung Electronics, once known for showcasing its "super gap" or "ultra gap" in chipmaking prowess, has taken an uncharacteristically quiet approach to its 2025 foundry events. The...
Wednesday 4 June 2025
New era begins in South Korea: Lee Jae-Myung takes the helm
South Korea had been navigating six months of political turbulence following former President Yoon Suk-Yeol's brief imposition of martial law late last year – a move that triggered...
Wednesday 4 June 2025
Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...
Wednesday 4 June 2025
Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster...
Wednesday 4 June 2025
Semco reportedly expanding semiconductor-use glass substrate ecosystem
Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics...
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Wednesday 4 June 2025
Samsung and Intel take foundry fight into each other's backyard
Samsung Electronics and Intel are taking their semiconductor foundry competition directly to each other's home turf in June, as both companies seek to narrow the gap with market leader...
Wednesday 4 June 2025
Samsung executives visit Nvidia headquarters to secure HBM supply deal
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
Tuesday 3 June 2025
Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs
In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
Samsung recruits former TSMC, NXP exec to lead US foundry push
Samsung Electronics' Device Solutions (DS) division has appointed former TSMC and NXP Semiconductors executive Margaret Han as vice president of its North American wafer foundry business,...
Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...