Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
Apple is significantly increasing automation efforts within its manufacturing supply chain, primarily in response to the trade war tariffs initiated under US President Donald Trump...
TSMC plans to increase foundry prices for its advanced semiconductor processes by approximately 5% to 10% in 2026, according to sources in the IC design industry.
Samsung Electronics is stepping up hiring for its US semiconductor operations, posting a wave of openings for engineers and process specialists in Austin and Taylor, Texas. The roles,...
Taiwan's 2026 defense budget is set to approach NT$1 trillion amid increases in military spending and heightened defense policies. This will lead to a major boost in maritime and...
Reports of TSMC halting Chinese equipment use and auditing Taiwanese suppliers have raised concern. The company said it does not comment on rumors, stressing its focus on risk management...
Advanced Micro-Fabrication Equipment (AMEC) reported sharp first-half 2025 revenue growth, driven by robust demand for advanced etching systems used in cutting-edge logic and memory...
Tex Year Industries is set to optimize its manufacturing operations across Taiwan, Vietnam, the US, and other Asian locations in response to ongoing tariffs and geopolitical challenges...
China's new energy vehicle leader BYD Auto has made headlines for aggressively expanding its overseas market. Its earlier plans to export electric vehicles (EVs) to Taiwan via its...
PC demand remains soft under macroeconomic pressures, but the phase-out of Windows 10 is expected to drive an upgrade cycle that will accelerate PCIe Gen5 adoption. NAND flash controller...
Micron is tightening its grip on Samsung's flagship smartphone supply chain, even as the South Korean tech giant works to steady its own memory production business.
Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
