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    Samsung, SK Hynix expansion puts Korea's chip supply chain to the test
    27min ago
    SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
    36min ago
    Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
    40min ago
    NEWS TAGGED PERFORMANCE
    Wednesday 29 July 2026
    NXP posts strong 2Q as investors remain cautious on chip outlook

    Despite robust performance in the automotive sector and growing demand for artificial intelligence, NXP Semiconductors' second-quarter...

    Wednesday 29 July 2026
    Shield AI and GE Aerospace complete X-BAT engine tests for late-2026 flight

    Shield AI and GE Aerospace said on July 20 that they had completed integration, actuation and engine ignition testing for the Axisymmetric...

    Tuesday 28 July 2026
    Nvidia's Vera targets AI server growth, with CSP adoption the key test
    Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing...
    Tuesday 28 July 2026
    China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused
    China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption...
    Monday 27 July 2026
    Samsung to use 2nm process for HBM5 base die as heat challenge grows

    Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

    Monday 27 July 2026
    Pegatron unveils AMD EPYC server platform for AI and HPC
    Pegatron unveiled a new server platform powered by AMD's sixth-generation EPYC processors at AMD Advancing AI 2026, targeting enterprise AI, agentic AI, high-performance computing...
    Monday 27 July 2026
    Rebellions readies Rebel100 shipments as AI inference demand grows
    South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial...
    Monday 27 July 2026
    Nokia says AI spending is driving optical networking demand
    AI data center spending is pushing high-speed networking higher on enterprise procurement lists, and Nokia said its optical and IP networks have become major growth engines. The company...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
    Friday 24 July 2026
    AMD launches ROCm.ai to accelerate agentic AI development, reporting up to 3.3x inference gains
    Alongside its expanding AI hardware portfolio, AMD is stepping up efforts to strengthen its AI software ecosystem in a bid to challenge NVIDIA's CUDA dominance. At its Advancing AI...
    Friday 24 July 2026
    AMD redraws server chip strategy as AI workloads evolve
    AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping...
    Friday 24 July 2026
    AMD unveils Helios rack-scale AI platform to target hyperscale buildouts
    AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...
    Friday 24 July 2026
    AMD splits next-generation data center GPUs for specialized AI demand
    AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the...
    Friday 24 July 2026
    Amkor, Nvidia widen AI packaging partnership as US capacity expands
    Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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