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Wednesday 1 October 2025
Notebook shipment update, August 2025

Introduction

Wednesday 1 October 2025
Samsung advances Exynos 2600 production as 2nm yield rises to 50%
Samsung Electronics has begun mass production of its next-generation application processor (AP), the Exynos 2600, which is expected to power the standard models of the Galaxy S26...
Wednesday 1 October 2025
Hotai Motor expects strong Q4 despite lingering market uncertainty
Despite ongoing uncertainty in Taiwan's auto market and a slower-than-expected recovery in showroom traffic, Hotai Motor Co. remains cautiously optimistic about achieving its full-year...
Wednesday 1 October 2025
Malaysian EMS giant posts first quarterly loss in five years on tariffs
V.S. Industry Bhd. reported a rare quarterly loss, its first in more than five years, as reciprocal tariffs and weaker customer demand weighed on sales. The Malaysian electronics...
Wednesday 1 October 2025
China's 12-inch SiC leap: SICC, Jingsheng in spotlight
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
Wednesday 1 October 2025
Nvidia falters in China; Huawei moves to fill AI chip vacuum
Huawei is set to expand Ascend AI chip output, seizing on Nvidia's shrinking position in China as US export curbs and Beijing's security mandates squeeze the American company's market...
Tuesday 30 September 2025
China's Zhaoxin breaks into healthcare: 6,000+ hospital PCs run x86 chips against Intel, AMD

Shanghai Zhaoxin Semiconductor has scored a breakthrough in China's healthcare sector. On September 23, the x86 chipmaker announced that...

Tuesday 30 September 2025
Qualcomm AI PC strategy emerges with enhanced creator features and gaming support
Qualcomm is set to officially launch its new PC chip series, Snapdragon X2 Elite, in 2025. To offer customers higher performance options, Qualcomm has developed the Snapdragon X2...
Saturday 27 September 2025
Samsung breaks silence on 12-layer HBM3E validation
Samsung Electronics is expected to confirm by late September 2025 that its 12-layer fifth-generation high-bandwidth memory (HBM3E) has cleared customer validation, South Korean media...
Saturday 27 September 2025
When LLMs outgrow the chip: Huawei's P/D separation redefines design choices
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture...
Friday 26 September 2025
Apple, Qualcomm, and MediaTek pivot toward AI accelerators as 3nm era closes

The 2025 generation of flagship smartphone chips will mark the final run for 3nm processors — closing a chapter in semiconductor...

Thursday 25 September 2025
TSMC and EDA partners use AI to boost chip design energy efficiency tenfold
TSMC and its partners have leveraged artificial intelligence (AI) software to enhance the energy efficiency of AI computing chips by roughly ten times. The company presented its latest...
Thursday 25 September 2025
Micron joins forces with TSMC for HBM4E memory, targeting 2027 launch
Micron Technology is partnering with TSMC to develop its next-generation HBM4E memory, targeting a market debut in 2027. The US chipmaker confirmed the plan during its fiscal fourth-quarter...
Thursday 25 September 2025
Qualcomm unveils Snapdragon 8 Elite Gen 5 and Snapdragon X2 Elite Extreme with major AI performance gains
Qualcomm officially launched its newest flagship platforms for smartphones and PCs on September 24. The company introduced the Snapdragon 8 Elite Gen 5 as its latest smartphone platform,...
Wednesday 24 September 2025
Taiwan's three major science parks report chip-driven record revenue in 1H25
The National Science and Technology Council's three major science parks achieved a combined revenue of NT$2.74 trillion (approximately US$90.6 billion) in the first half of 2025,...