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Friday 3 July 2026
Kioxia begins sample shipments of 10th-generation flash memory
Kioxia has begun sample shipments of 1Tb triple-level-cell memory devices built with its 10th-generation BiCS FLASH 3D flash memory technology. The move underscores the race to supply...
Friday 3 July 2026
Zyxel Networks adds outdoor wireless access point for MSP customers
Zyxel Networks, the commercial networking brand under Zyxel Group, announced a new outdoor wireless access point on the 2nd as it targets managed service provider (MSP) demand for...
Friday 3 July 2026
Huawei's Ascend AI chips target South Korea in new Nvidia challenge

Huawei is reportedly preparing to launch its AI chips in South Korea for the first time in the fourth quarter of 2026, as rising demand...

Thursday 2 July 2026
Socionext to develop TSMC A14 chiplet for AI data center SoCs

Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project...

Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip...

Wednesday 1 July 2026
Tenstorrent's Jim Keller says startup will outpace Cerebras as AI chip competition intensifies

AI chip competition is widening beyond raw performance, a shift that matters for global cloud providers, device makers, and investors...

Wednesday 1 July 2026
Anthropic's Sonnet 5 delivers near-Opus performance at 60% lower cost as export ban lifts
The US Commerce Department on June 30 removed export restrictions on two of Anthropic's most advanced AI models, ending a roughly three-week freeze that had disrupted enterprise and...
Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

Monday 29 June 2026
BYD's in-house smart driving chip reportedly faces long road to production vehicles despite vertical integration push
BYD's newly unveiled Xuanji A3 autonomous driving chip may represent a major milestone in the company's semiconductor ambitions, but industry experts say bringing the processor into...
Monday 29 June 2026
US AI restrictions face scrutiny as Chinese models gain ground

Chinese artificial intelligence developer Zhipu AI, also known as Z.ai, is narrowing the performance gap with leading US AI companies...

Monday 29 June 2026
Jih Lin rides AI power demand to clip packaging
Jih Lin is seeing stronger business momentum as higher power consumption per AI server rack drives data-center power management toward 800V high-voltage direct current (HVDC) architectures,...
Friday 26 June 2026
Apple reportedly revamps Mac chip roadmap to accelerate AI push
Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...
Friday 26 June 2026
IBM breaks sub-1nm barrier with 3D nanostack transistor platform
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
Thursday 25 June 2026
Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
Thursday 25 June 2026
Nvidia and AWS deepen push to simplify AI infrastructure at scale
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...