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    LG Electronics's three strategies to counter competition from Chinese brands
    2h 43min ago
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    2h 43min ago
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    2h 43min ago
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    2h 43min ago
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    2h 43min ago
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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    NEWS TAGGED PERFORMANCE
    Thursday 27 August 2026
    Xiaomi's Xring O3, O100 and D100 define a three-tier AI chip strategy beyond smartphones
    Xiaomi is expanding Xring from a smartphone chip program into a broader AI computing platform spanning consumer devices, vehicles, and edge inference, with three processors assigned...
    Thursday 27 August 2026
    Tesla doubles down on custom AI chips as Musk claims AI5 can beat NVIDIA on efficiency and cost
    Tesla CEO Elon Musk recently said the company's upcoming AI5 inference chip could deliver two to three times the performance per watt of Nvidia products when deployed in autonomous...
    Wednesday 26 August 2026
    Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
    At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
    Wednesday 26 August 2026
    TCL, Asus drop China OLED as LGD gains edge
    TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted...
    Wednesday 26 August 2026
    Nvidia earnings hinge on Rubin ramp and Vera CPU
    Nvidia will release its fiscal second-quarter 2027 financial results on August 26, US time. Given Nvidia's performance pattern in recent quarters, Wall Street has come to expect a...
    Wednesday 26 August 2026
    Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition
    Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...
    Wednesday 26 August 2026
    Nvidia unveils Jetson Orin Nano 2 for edge AI robots and drones
    Nvidia has introduced Jetson Orin Nano 2, a compact robotics computer aimed at entry-level edge AI, with implications for developers building autonomous machines worldwide. The system...
    Wednesday 26 August 2026
    OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
    OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
    Wednesday 26 August 2026
    Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm
    Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
    Wednesday 26 August 2026
    Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon
    As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

    SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...

    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Monday 24 August 2026
    Samsung DX hits first quarterly loss on chip inflation

    Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit...

    Friday 21 August 2026
    Vecow eyes robotics growth as North America, EMEA account for 65% of business
    Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for...
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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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