Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor...
Taiwan-based Yageo Corporation has refiled its foreign investment application under Japan's Foreign Exchange and Foreign Trade Act (FEFTA) as of June 2, in a renewed bid to acquire...
Taiwan-based niche PCB maker First Hi-tec Enterprise is riding strong momentum from the AI server sector and expects its 2025 revenue to surpass NT$10 billion (US$307 million), according...
Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB manufacturer...
German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture...
Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics serving...
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical giant...
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...
