TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...

Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised...

India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference...

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...

Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...

Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...