Taiwan's IC OSAT supply chain was previously expected to benefit from US Bureau of Industry and Security (BIS) restrictions on Chinese semiconductor firms. The BIS's semiconductor...

Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.

Japanese optical giant Canon, which had not built a new semiconductor lithography equipment production plant since 2004 due to a declining market, announced on July 30, 2025, the completion...

ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...

Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...