The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.

Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year...

Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...

Intel has partnered with 14 Japan-based companies to develop manufacturing technology for IC backend manufacturing automation, which is anticipated to be commercialized by 2028, aiming...