Japanese telecommunications company NTT is encountering significant challenges in its efforts to mass-produce co-packaged optics (CPO), a next-generation technology increasingly critical...

Samsung Electronics is reportedly planning to outsource the production of photomasks used in memory manufacturing. To prevent technology leaks, Samsung has traditionally produced...

Ardentec Corporation reported in its first-quarter 2025 earnings call that strong demand for AI- and HPC-related communications products, along with gains from back-end packaging...

Wafer-probing specialist Ardentec anticipates commencing operations at its new plant in Longtan, northern Taiwan, in the second quarter of 2025.

In the Chinese automotive market, emerging manufacturers such as NIO, Xpeng, Li Auto, and Leapmotor have long been emblematic of the industry's shift toward self-developed intelligent...

German optics giant Carl Zeiss AG has signaled a major commitment to India by opening its first global capability center (GCC) in Bengaluru and announcing plans to double its local...

Intel CEO Pat Gelsinger was recently in Taiwan for a brief visit to meet with TSMC chairman C. C. Wei at the Hsinchu Science Park (HSP), according to sources familiar with the matt...

TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...

TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...

Panram International, a Taiwan-based memory module contract manufacturer, announced plans to lay off about 250 employees, nearly half of its total workforce, from its contract manufacturing...

Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...

Intel Corp. is trying to strike a balance between design and manufacturing.

Huang showcased his diplomatic flair at Nvida's AI developers' conference.

China-based smartphone makers are reportedly talking with Indian EMS providers for mobile phone manufacturing, as Chinese investments in the South Asian country fell significantly...

In 1989, Intel initially contracted TSMC to manufacture its products. F.C. Tseng, former vice chairman of TSMC, stated at a public event in Taiwan, "I knew this was Intel's conspiracy...