Vietnam is solidifying its position as a major hub for South Korea's information and communications technology (ICT) industry, driven by government digitization initiatives and a...
India, traditionally seen as a global hub for IT services, exports second only to the US, is now shifting focus towards becoming a significant player in semiconductor manufacturing...
The US government announced a one-time fee of US$100,000 for new H-1B visa applicants. Industry insiders warn this could prompt companies to increase offshoring and accelerate artificial...
Taiwan's high-tech manufacturers are encountering significant challenges as they establish factories overseas, particularly due to cost pressures stemming from US President Donald...
Just four months into his tenure, new Intel CEO Lip-Bu Tan has introduced a decisive shift in strategy. During the company's second-quarter 2025 earnings call, Tan suggested a potential...
Japanese telecommunications company NTT is encountering significant challenges in its efforts to mass-produce co-packaged optics (CPO), a next-generation technology increasingly critical...
Samsung Electronics is reportedly planning to outsource the production of photomasks used in memory manufacturing. To prevent technology leaks, Samsung has traditionally produced...
Ardentec Corporation reported in its first-quarter 2025 earnings call that strong demand for AI- and HPC-related communications products, along with gains from back-end packaging...
In the Chinese automotive market, emerging manufacturers such as NIO, Xpeng, Li Auto, and Leapmotor have long been emblematic of the industry's shift toward self-developed intelligent...
German optics giant Carl Zeiss AG has signaled a major commitment to India by opening its first global capability center (GCC) in Bengaluru and announcing plans to double its local...
Intel CEO Pat Gelsinger was recently in Taiwan for a brief visit to meet with TSMC chairman C. C. Wei at the Hsinchu Science Park (HSP), according to sources familiar with the matt...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
Panram International, a Taiwan-based memory module contract manufacturer, announced plans to lay off about 250 employees, nearly half of its total workforce, from its contract manufacturing...
