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NEWS TAGGED OPTICS
Thursday 15 January 2026
Taiwan accelerates drive to build silicon photonics ecosystem

Taiwan's government is stepping up cross-ministerial support to build a domestic silicon photonics ecosystem, with a focus on strengthening...

Wednesday 14 January 2026
CPO module output to grow by 137% annually as Taiwan fosters key photonic tech
Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...
Tuesday 13 January 2026
Taiwan pushes silicon photonics frontier R&D to defend semiconductor edge in AI era
Taiwan dominates advanced semiconductor manufacturing, but mounting competition in emerging technologies is exposing structural gaps. To secure its position in the AI and data-center...
Friday 9 January 2026
Taiwan targets SiPh CPO-AI ecosystem in 10-year plan
Taiwan's National Science and Technology Council (NSTC) has designated the silicon photonics (SiPh) co-packaged optics (CPO)-AI ecosystem as a core focus for the next decade, aiming...
Monday 29 December 2025
IntelliEPI partners with EZconn to boost AI optical communication
The surge in AI-driven high-speed computing and data transmission demands has prompted major players to invest heavily in co-packaged optics (CPO) technology. Compound semiconductor...
Tuesday 23 December 2025
Exclusive: Why photons beat copper in AI factories—Celestial AI Co-founder on Marvell's acquisition
In a year when artificial intelligence spending has begun to resemble a national infrastructure program, Celestial AI has chosen to stop being a standalone startup. Preet Virk, the...
Tuesday 16 December 2025
China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Wednesday 3 December 2025
BizLink to acquire XFS Communications, expand optical interconnect business

BizLink said on December 1 that it signed a definitive agreement to acquire Shenzhen-based XFS Communications, aiming to expand its optical...

Saturday 29 November 2025
Taiwan optics firms shift to AR glasses as China cuts costs
Taiwan's optical component makers are stepping up spending on augmented reality glasses to capture rising demand worldwide, while Chinese competitors accelerate development of cheaper,...
Friday 28 November 2025
Taiwan's Kinko Optical targets US LEO satellite supply chain as infrared business expands

Kinko Optical signaled an ambitious push into space-related components and next-generation optics at an investor briefing on the 25th,...

Monday 17 November 2025
GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

Friday 14 November 2025
Coretronic and Radiant expand beyond displays, betting on drones and advanced optics
Taiwan's leading backlight module suppliers, Coretronic and Radiant Opto-Electronics, are diversifying into new sectors as demand in the traditional display market slows. The new ventures...
Thursday 13 November 2025
GIS bets on OLED and optics as the display industry shifts to high-end applications
The rapid adoption of OLED panels in high-end display applications is becoming unstoppable, signaling a structural shift in the display industry. According to General Interface Solution...
Thursday 13 November 2025
India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...