Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Introduction

Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...

Radiant Opto-Electronics (ROEC) is moving into AI optical communications through acquisitions. Chairman Yu-Chao Wang is targeting the...

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...