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Friday 27 May 2022
Maxscend to commercialize production of SAW filters
China-based Maxscend Microelectronics, dedicated to supplying RF frontend chips such as RF switches and low-noise amplifiers, is set to kick off trial production of SAW (surface acoustic...
Thursday 24 March 2022
Japan MLCC makers maintaining prices despite slowdown in CE demand
A slowdown in demand for consumer electronics devices has prompted Taiwan-based MLCC suppliers to cut commodity MLCC prices, but their larger Japan-based peers continue to keep prices...
Monday 21 March 2022
Yageo business transformation efforts paying off
Taiwan's leading passive component vendor Yageo will continue to advance its business transformation in 2022 by expanding its product lines and optimizing its shipment portfolios...
Tuesday 4 January 2022
Nissan tweaks car design to tackle chip shortage
While the auto chip shortage is easing, some electronic components suppliers continue delaying delivery. The situation prompted carmakers like Nissan to adjust the design to use different...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Monday 2 August 2021
TSMC, Amkor to process IPD chips for new Apple devices
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
Friday 25 June 2021
Zhen Ding, Flexium enjoy strong Apple orders for antenna modules
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Tuesday 25 May 2021
Murata, Cooler Master announce ultra-thin vapor chamber
Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.
Wednesday 24 February 2021
High-capacitance MLCC prices set to rise
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
Thursday 14 January 2021
Fire strikes Walsin MLCC plant in China
A fire broke out at Taiwanese passive component maker Walsin Technology's factory site in Dongguan, China on January 13, but the company estimates no material impact from the accid...
Friday 8 January 2021
Chilisin sees order visibility for molding chokes extended
Chilisin Electronics has seen order visibility for molding chokes extended to more than four months, and is also expected to ramp up its shipments of LTCC (low temperature co-fired...
Thursday 19 November 2020
Apple may rely more on Taiwan PCB suppliers in 2021
Apple is expected to ramp up flexible PCB (FPCB) demand for its 2021 devices, and is looking to work more closely with its Taiwan-based suppliers including Zhen Ding Technology, Compeq...
Wednesday 18 November 2020
LTCC device maker ACX to ready new capacity in 3Q21
Advanced Ceramic X (ACX), which specializes in LTCC (low-temperature co-fired ceramic) modules, has disclosed plans to build additional capacity that will come online in the third...
Thursday 3 September 2020
New iPhones to stoke demand for LCP FPCB modules
Demand for LCP (liquid crystal polymer)-based flexible PCBs is expected to pick up significantly as they will be featured in 5G iPhones' mmWave antenna modules and in other high-speed...
Research Report Database
Summary of Tech Supply Chain News!
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research