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NEWS TAGGED MEMORY
Friday 2 August 2024
SK Hynix to unveil next-gen AI memory innovations at FMS 2024
SK Hynix is set to showcase its latest advancements in its memory technologies and products at the upcoming Future Memory and Storage (FMS) 2024 event.
Tuesday 30 July 2024
China accelerates HBM production for AI, CXMT expands for self-sufficiency amid sanctions
China is ramping up its efforts to produce High-Bandwidth Memory (HBM), crucial for advancing AI technology, as part of its supply chain indigenization strategy.
Tuesday 30 July 2024
Memory spot prices steady, demand disappoints
Memory prices are expected to remain stable or go up in the third quarter of 2024 for different market segments, but consumer demand will continue to be disappointing, according to...
Thursday 25 July 2024
Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Wednesday 17 July 2024
HBM4 poised to revolutionize memory performance in HPC applications
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
Wednesday 17 July 2024
TSMC joins HBM4 arena with 5nm base chip production for memory giants
While SK Hynix, Samsung Electronics, and Micron Technology are locked in an intense technology race for the sixth-generation High Bandwidth Memory (HBM), HBM4, foundry giant TSMC...
Tuesday 16 July 2024
Server HBM, DDR5 demand to stay high until 2025, says distributor Supreme Electronics
Demand for High-Bandwidth Memory (HBM) and DDR5 RAM for servers has steadily risen as Cloud Service Providers (CSP) in North America continue building data centers, with IC distributor...
Monday 15 July 2024
JEDEC nears HBM4 standard finalization
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Wednesday 3 July 2024
Winbond chairman anticipates memory market rebound in 2H24
Winbond Electronics Chairman Arthur Yu-Cheng Chiao expressed optimism about the memory market, indicating that the second half of 2024 will enter an upward cycle extending into 202...
Monday 1 July 2024
HBM creates winners in the semiconductor ecosystem in 2Q24
Despite ongoing inventory challenges, global semiconductor providers have seen substantial increases in market valuations over the past quarter.
Thursday 27 June 2024
China sees bumpy road ahead for homegrown HBM development, lagging memory giants by 10 years
China's development of homegrown High Bandwidth Memory (HBM) has a long way to go, lagging behind international memory giants by 10 years.
Thursday 27 June 2024
Memory contract prices to rise in 3Q24
Contract market prices for memory chips are still expected to increase in the third quarter of 2024 despite the sluggish trading in the spot market, according to industry sources.
Wednesday 26 June 2024
Micron poised to bet on high-efficiency HBM, more DRAM for AI phones
The 2024 memory market has been heavily focused on High Bandwidth Memory (HBM) for cloud AI servers.
Tuesday 25 June 2024
Samsung to resume P5 construction as AI surges memory demand
To address the rising memory demand of the AI boom, Samsung is resuming the construction of its new Pyeongtaek plant 5 (P5), with construction beginning as early as the third quarter...
Monday 24 June 2024
Fire at Micron Taiwan fab raises memory chip price concerns
A fire recently broke out at Micron Technology's DRAM fab in Taichung, central Taiwan, prompting concerns among industry participants regarding the short-term pricing trend.