CONNECT WITH US
NEWS TAGGED LITHOGRAPHY
Friday 9 February 2018
Globalfoundries 22FDX process to attract more orders, says company executive
After securing orders from STMicroelectronics, Globalfoundries' 22nm FD-SOI (22FDX) process is being evaluated by hundreds of potential customers looking to use a more advanced fully-depleted...
Tuesday 6 February 2018
AGC to make expansion to supply system for EUV mask blanks
AGC Asahi Glass (AGC) has decided to drastically expand a supply system for EUV lithography mask blanks at one of its group companies, AGC Electronics, in 2018, according to the Japan-based...
Wednesday 25 October 2017
Globalfoundries to adopt EUV for 7nm FinFET
Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...
Friday 20 October 2017
TSMC raises IC market forecasts for 2017
Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...
Monday 2 October 2017
Plant construction geared up at major China memory bases
China's three major memory production bases, Wuhan, Fujiang and Hefei, are seeing construction of DRAM and NAND flash manufacturing plants moving into high gear, with the No. 1 plant...
Wednesday 27 September 2017
DRAM transition to EUV for sub-10nm node remains a financial challenge
Major DRAM chipmakers will continue to use multiple patterning exposure techniques for their 1x/1y nodes, but a question mark is still hanging over the prospect of their switch to...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Wednesday 13 September 2017
SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools
At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...
Wednesday 13 September 2017
ASML EUV equipment production to almost double in 2018
ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
Tuesday 12 September 2017
Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Thursday 24 August 2017
ASML opens branch office in Nanjing
ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.
Wednesday 16 August 2017
Globalfoundries demos 2.5D HBM solution
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Thursday 3 August 2017
Commentary: Can Samsung Foundry unseat TSMC?
Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...
Monday 24 July 2017
Marketech to enjoy robust OEM orders, says report
Taiwan-based Marketech International is set to enjoy a ramp-up of OEM orders from ASML for a component used in the fab tool vendor's extreme ultraviolet (EUV) lithography equipment...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...