The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Kinsus Interconnect Technology, a Taiwan-based maker of IC substrates, is expected to see revenues for the third quarter of 2012 grow up to 5% sequentially from NT$4.493 billion (US$150...
IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...
Taiwan-based IC substrate maker Kinsus Interconnect Technology reported 2011 total revenues of NT$16.871 billion (US$563 million), up 15.05% on year. Kinsus' fourth-quarter 2011 revenues...
Qualcomm, MediaTek, Nvidia and Spreadtrum Communications have all increased their wafer starts at Taiwan Semiconductor Manufacturing Company (TSMC) to meet anticipated demand for...
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...
IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...
IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...
IC-packaging substrate maker Kinsus Interconnect Technology has stated that it has landed sufficient orders for July and August with order momentum to further strengthen onward month...
Nan Ya Printed Circuit Board (NPC) saw a sequential decline in June revenues, while Kinsus Interconnect Technology's June figures enjoyed growth and hit a record high.
IC substrate makers Nan Ya PCB and Kinsus Interconnect both are expected to see their revenues continue to move upward in June and the third quarter after posting strong gains in...
IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...
