Consolidated revenues at Taiwan-based PCB manufacturer Unimicron Technology registered decreases of 16.5% sequentially and 10.7% on year in the first quarter of 2013.
Share prices of Kinsus Interconnect Technology rallied NT$3 (US$0.1) or 3.2% to close at NT$97.5 on the Taiwan Stock Exchange (TSE) on February 18, after the company reported record-high...
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
Kinsus Interconnect Technology, a Taiwan-based maker of IC substrates, is expected to see revenues for the third quarter of 2012 grow up to 5% sequentially from NT$4.493 billion (US$150...
IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...
Taiwan-based IC substrate maker Kinsus Interconnect Technology reported 2011 total revenues of NT$16.871 billion (US$563 million), up 15.05% on year. Kinsus' fourth-quarter 2011 revenues...
Qualcomm, MediaTek, Nvidia and Spreadtrum Communications have all increased their wafer starts at Taiwan Semiconductor Manufacturing Company (TSMC) to meet anticipated demand for...
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...
IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...
IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...
IC-packaging substrate maker Kinsus Interconnect Technology has stated that it has landed sufficient orders for July and August with order momentum to further strengthen onward month...
