The Southern Taiwan Science Park (STSP) has reported record-high sales of NT$2.21 trillion (approx. US$67.05 billion) for 2024, rising 39.55% year-over-year, with strong momentum...
At Embedded World 2025, Altera made a bold case for FPGAs in AI computing, arguing they can rival ASICs in edge AI. While FPGAs are already entrenched in industrial control, they...
Foxconn, the world's largest electronics contract manufacturer, announced record-breaking revenue for 2024, reaching NT$6.86 trillion (US$216 billion). The milestone, revealed by...
Driven by strong cloud networking products, Foxconn (Hon Hai) Technologies anticipates solid revenue growth in 2024, with profit performance surpassing that of 2023.
The AI agent sector represents a significant direction in recent AI applications. While the market has various interpretations of AI agents, a common requirement is for greater automation...
On the evening of March 12, Lens Technology announced plans to issue overseas foreign-listed shares (H-shares) and seek a listing on the main board of the Hong Kong Stock Exchange...
Server sliding rail maker Nan Juen International (Repon) has seen increased revenue since February 2025, driven by demand from US-based cloud service provider (CSP) clients, and will...
Industrial computer (IPC) manufacturer Ubiqconn Technology, a subsidiary of FIC Group, has acquired 100% of the shares of US display panel manufacturer E3 Displays (E3D) in an all-cash...
Chenbro Micom expects significant revenue and profit growth in early 2025, fueled by strong AI server demand in the US and China. CEO Corona Chen is optimistic that full-year results...
ByteDance's Doubao AI team has open-sourced COMET, a Mixture of Experts (MoE) optimization framework that improves large language model (LLM) training efficiency while reducing costs...
Flex has been named one of the 2025 World's Most Ethical Companies by Ethisphere, marking its third consecutive year of recognition in the industrial manufacturing category. The honor...
Winmate's chairman, Ken Lu, has expressed optimism about the company's prospects for 2025, citing consistent order growth across multiple sectors, including vehicle inspection, defense,...
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently...
Syscom Computer Engineering, a close partner of Microsoft, will unveil a range of generative AI innovations spanning seven major areas, including AI infrastructure, system applications,...
The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
