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Thursday 25 June 2009
Driver IC backend supplier IST aims to turn profitable in 2H09
Taiwan-based International Semiconductor Technology (IST) aims to swing back to profitability in the second half of 2009, as the driver IC backend supplier has enjoyed increased demand...
Tuesday 9 June 2009
Driver IC backend suppliers May sales up on improved utilization
Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...
Friday 5 June 2009
Driver IC backend suppliers see order visibility extend to October as panel demand increases in China
Taiwan's LCD driver IC backend service suppliers have seen order visibility extend to October, driven by increased orders from China's LCD TV market due to the government's expanded...
Monday 11 May 2009
LCD driver IC backend service suppliers may raise prices on tight supply
Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) may increase the quotes for their driver IC backend services in July 2009...
Friday 8 May 2009
Compal expects notebook shipments to grow 15-20% sequentially in 2Q09, says company president
Compal Electronics expects its second-quarter notebook shipments to grow 15-20% to 7.2-7.5 million units from 6.3 million units shipped in the first quarter, company president Ray...
Wednesday 6 May 2009
Driver IC backend suppliers 2Q09 sales expected to rise over 80%
Driver IC packaging and testing companies Chipbond Technology and International Semiconductor Technology (IST) are likely to enjoy revenue growth of more than 80% sequentially in...
Wednesday 8 April 2009
Driver IC packaging firms to reach full utilization by end of 2Q09
Taiwan-based LCD driver IC packaging and testing houses are expected to see their fabs running at full capacity by the end of the second quarter, as more Japan-based IDMs have begun...
Thursday 19 March 2009
Driver IC packaging firms see capacity utilization improve on China demand
Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity...
Monday 9 March 2009
Most IC backend service suppliers see siginificant growth in February
Most packaging and testing houses, including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL), saw significant increases in sales in February, thanks...
Thursday 11 December 2008
LCD driver IC backend company IST sees NT$95 million losses in November
Packaging and testing house International Semiconductor Technology's (IST's) November sales were NT$193 million (US$5.78 million), representing a 34% sequential decline, the company's...
Wednesday 5 November 2008
Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
Wednesday 1 October 2008
IST sees low utilization; reports losses for August
Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...
Thursday 29 May 2008
Chipbond and IST prepare further price raise for gold bumping in 3Q08
Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order...