Chipbond Technology has filed an application with the Taiwan government to take up a majority stake in China-based Chipmore Technology, which it now owns almost 20%, according to...
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Chipbond Technology has reported revenues of NT$801 million (US$25 million) for March 2010, with revenues for the first quarter beating its previous estimates. The LCD driver IC packaging...
LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...
An earthquake measuring 6.4 on the Richter scale hit a mountainous region in southern Taiwan earlier this morning, causing injuries, damaging buildings and disrupting transportation...
Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
LCD driver IC packaging and testing houses are considering raising their quotes soon in part due to tight production resulting from a surge in demand and in part due to persistent...
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
The merger of Chipbond Technology and International Semiconductor Technology (IST) is expected to help the Compal Group turn its investment in IST from a loss to profit, according...
