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    China's optical supply chain gains ground in smart glasses
    6h 5min ago
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    6h 5min ago
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    6h 5min ago
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    6h 5min ago
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    6h 5min ago
    NEWS TAGGED INTERVIEW
    Wednesday 16 September 2026
    Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
    The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    Tuesday 15 September 2026
    The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
    "He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Monday 7 September 2026
    Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says
    Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...
    Monday 7 September 2026
    Exclusive: Infineon COO says chip shortage recovery will take longer
    Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...
    Saturday 5 September 2026
    Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race
    "Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as...
    Saturday 5 September 2026
    Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics
    Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial...
    Monday 31 August 2026
    Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift
    As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...
    Saturday 29 August 2026
    Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition
    Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.
    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    AI chip roadmaps force faster changes in data-center design, Cadence says
    Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
    Monday 24 August 2026
    Interview: Inside Foxconn's playbook for the sovereign AI data center race
    Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
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    GlobalExhibition
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Semicon_TW