CONNECT WITH US
NEWS TAGGED INTERVIEW
Wednesday 22 July 2026
Interview: Why agentic AI could be SiPearl's biggest break—and Europe's

Philippe Notton has spent nearly 20 years traveling to Taiwan roughly once a month. That rhythm—born from his time at MStar Semiconductor...

Monday 20 July 2026
Interview: AI race is now a financing race, and Compute Labs wants to bankroll GPUs
As AI's bottleneck shifts from chips to capital, Compute Labs pitches GPUs as financeable assets.
Monday 20 July 2026
Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Monday 20 July 2026
Interview: AI's rise is pushing Singapore and ASEAN firms toward multicloud and security bets
As AI moves from experimentation to deployment, enterprises in Singapore and across ASEAN are shifting their focus from cloud adoption to multicloud integration, cybersecurity, and...
Sunday 19 July 2026
Interview: The pragmatic playbook behind Agility Robotics' rise

Humanoid robots are very hyped these days. They are performing ever more impressive feats, from pulling off coordinated dance performances...

Sunday 19 July 2026
Interview: Merck's origins trace back to 358-year-old Engel Pharmacy
Merck did not begin in a laboratory, but in a neighborhood pharmacy that still opens every day to fill prescriptions for local residents. The Engel Pharmacy in central Darmstadt, Germany,...
Friday 17 July 2026
Exclusive: SiPearl turns to Taiwan ODMs to bring Rhea-based servers to market

SiPearl has powered on and begun validating Rhea1, its first-generation server CPU designed in Europe. Its next challenge is convincing...

Friday 17 July 2026
Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn...

Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Saturday 11 July 2026
Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

Thursday 9 July 2026
Interview: UK courts Taiwan suppliers for AI hardware buildout
The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers, seeking to turn its AI infrastructure push into a market and investment opportunity...
Tuesday 7 July 2026
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos...
Tuesday 7 July 2026
Interview: Corning's GlassBridge points to longer-term packaging shifts, not an immediate FAU replacement

Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...

Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...