"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...
Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...
"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as...
Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial...
As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...
The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
