Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Monday 12 July 2021
Vendors of third-gen semiconductors enhance regional production, sales schemes
Vendors of third-generation semiconductors including GaN and SiC (silicon carbide) are stepping up regional production and marketing deployments to better explore immense demand for...
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
Wednesday 9 June 2021
Tight foundry capacity to persist throughout 2021
Taiwan-based pure-play foundries continue to see customers pull in orders despite concerns about overbooking, and will see their fab capacity stay extremely tight throughout 2021,...
Wednesday 5 May 2021
GaAs foundry AWSC to post revenue growth through June
GaAs foundry Advanced Wireless Semiconductor Company (AWSC) is expected to enjoy sequential revenue increases through June, and will see further revenue growth after new production...
Tuesday 4 May 2021
Intel to invest US$3.5 billion to boost advanced packaging technologies
Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros...
Thursday 29 April 2021
Fabless suppliers hold record-high 33% of 2020 IC market
Fabless IC suppliers saw their combined sales register a strong 24% rise in 2020, while IDMs' grew by only 8% on year. Fabless company IC sales accounted for a record-high 32.8% of...
Wednesday 7 April 2021
III-V IC firms embrace growing PA, RF demand as revenue booster
Taiwan's III-V semiconductor players including foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC), and IDM Transcom have all reported impressive sales results...
Tuesday 30 March 2021
Taiwan OSATs not expecting much business from Intel new foundry strategy
Taiwan-based OSAT providers are not expecting much business opportunity to be coming from Intel's new manufacturing strategy, dubbed IDM 2.0.
Wednesday 24 March 2021
Highlights of the day: Intel unveils IDM 2.0 bid
Intel has unveiled its so-called IDM 2.0 strategy, with a US$20 billion plan to build two fabs in the US to beef up...
Wednesday 24 March 2021
Analog IDMs extending delivery lead times
Analog IDMs have prolonged their delivery lead times to as long as 40 weeks as they probably have given priority to producing automotive chips that have been in severe short supply,...
Tuesday 23 March 2021
PTI to offer Renesas additional backend capacity support
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Tuesday 23 February 2021
IDMs may evaluate more outsourcing
IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.
Monday 25 January 2021
Intel not yet a major customer of TSMC
Despite speculation circulating recently that Intel is looking to outsource more chip production to TSMC, the CPU vendor does not seem to be ready to play a meaningful role in the...
Thursday 7 January 2021
Win Semi posts record 2020 revenue
GaAs foundry Win Semiconductors has reported revenue climbed 18.8% on year to a record high of NT$25.37 billion (US$905.71 million) in 2020.