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Wednesday 6 May 2026
GlobalFoundries sees optical and SiGe momentum drive strategic leap into high-value chip markets
GlobalFoundries used its first-quarter 2026 earnings call to spotlight advances in silicon photonics (SiPh), co-packaged optics (CPO), and silicon-germanium (SiGe) development while...
Wednesday 6 May 2026
Tata Electronics targets US$30B semiconductor buildout to anchor India’s manufacturing push
Tata Electronics is rapidly emerging as one of India's most ambitious bets in the global semiconductor and electronics industry, with a long-term goal of building a US$30 billion business...
Wednesday 6 May 2026
Lumentum sees explosive expansion as AI demand fuels record results
Lumentum reported record third-quarter fiscal 2026 results, with revenue rising to US$808 million, reflecting strong year-over-year growth driven by demand for optical components used...
Wednesday 6 May 2026
GlobalFoundries signals stronger second half despite mixed end-market demand
GlobalFoundries reported first-quarter results broadly in line with expectations, with management highlighting solid execution and profitability at the upper end of guidance ranges,...
Wednesday 6 May 2026
From China to Arizona: How AI and TSMC are redrawing Taiwan's economic map
Taiwan's decades-long tilt toward China is giving way to a sharper, US-focused strategy. Semiconductor expansion and surging demand for AI infrastructure are redrawing the island's...
Wednesday 6 May 2026
Southeast Asia's fab deficit threatens a chip boom shutout
Global semiconductor sales are projected to reach US$1 trillion this year and could double to US$2 trillion by 2035, driven by rapid growth in AI data centers. But the boom is also...
Wednesday 6 May 2026
Samsung board chairman warns strike could disrupt chip output

Samsung Electronics' labor dispute is widening beyond a fight over bonuses, after board chairman Shin Je-yoon made a rare appeal for management...

Tuesday 5 May 2026
Tesla AI5 dual sourcing may not mean equal weight for Samsung
Tesla CEO Elon Musk has confirmed that the company's in-house AI5 chip has completed design tape-out and entered a critical pre-production validation stage. The move has drawn renewed...
Tuesday 5 May 2026
Ardentec's Longtan plant to start AI ASIC testing in 3Q26
Ardentec's Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the semiconductor testing provider moves to capture spillover demand from...
Tuesday 5 May 2026
Another Qualcomm exec joins Intel to lead PC and physical AI unit
Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
Tuesday 5 May 2026
As Nvidia goes to zero in China, Beijing races to fill the void
Nvidia CEO Jensen Huang said the company's share of China's data-center computing market has dropped to zero. The admission underscores how US export controls are reshaping the country's...
Tuesday 5 May 2026
SEMICON SEA 2026: the trillion-dollar chip era is already here
The global semiconductor industry is entering a "multi-trillion-dollar" growth cycle sooner than expected, SEMI President and CEO Ajit Manocha said, urging Southeast Asian countries...
Tuesday 5 May 2026
Apple reportedly explores Intel and Samsung chip production to reshape advanced manufacturing strategy
Apple is exploring a significant shift in its semiconductor supply chain, holding early discussions with Intel and Samsung Electronics to produce the main processors used in its devices,...
Tuesday 5 May 2026
Intel PC chip roadmap takes shape as Razor Lake, Titan Lake stay on track
Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve,...
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...