CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Friday 1 November 2024
Intel secures two design wins for 18A, but 0.4 defect density unfit for mass production
Intel's third-quarter results exceeded expectations amid ongoing cost reduction efforts. Intel secured two design wins from customers and shared its partnerships with AMD and TSMC.
Friday 1 November 2024
China SiC industry faces restructuring; Taiwan firms seek differentiation
With SiC production capacity rising in China, prices have fallen dramatically, potentially leading to a restructuring of China's SiC industry and prompting Taiwan-based players to...
Friday 1 November 2024
Intel CEO to visit TSMC in November, say sources
Intel CEO Pat Gelsinger will visit TSMC in Taiwan in November, according to industry sources, who also believe that recent media claims about TSMC withdrawing the Intel discount are...
Friday 1 November 2024
Intel posts deepening loss due to restruction, but analysts eye potential turnaround
Intel reported deepening losses amid ongoing restructuring efforts, with Intel Foundry incurring an operating loss of US$5.8 billion. However, the results exceeded analyst expectations,...
Thursday 31 October 2024
WinSemi sees support from satellite, Wi-Fi 7, optical communications despite weak China handset demand
GaAs foundry house Win Semiconductors (WinSemi) has offered a weak outlook for China's Android phone market in the fourth quarter of 2024, but expects significant results from satellite,...
Thursday 31 October 2024
China's market rescue policies take effect; Holtek expresses optimism for 2025
Microcontroller unit (MCU) manufacturer Holtek has observed increasing demand for small household appliances during China's Singles' Day and Double 12 shopping festivals. The company...
Thursday 31 October 2024
GF aims to revitalize foundry business in China with team expansion planned for 2025
GlobalFoundries (GF) is looking to revitalize its operations in China. K.C. Ang, who became GF's president for Asia and chairman for China earlier this year, recently said at an annual...
Thursday 31 October 2024
Samsung breaks record in sales in 3Q24, memory business still falls short
Samsung Electronics achieved a historic high in revenue for the third quarter of 2024. Yet, overall operating profit fell short of market expectations, primarily due to one-time expenses...
Thursday 31 October 2024
Xiaomi targets Huawei and Apple with US$6.7 billion R&D push by 2025
Xiaomi, entering its fifth year in the high-end smartphone market, has once again rolled out its annual flagship phone, the Xiaomi 15, setting itself as a contender against Apple...
Thursday 31 October 2024
Second place foundry stakes: Samsung and Intel seek strategic overhaul under TSMC's shadow
Regardless of Samsung and Intel's third-quarter earnings, the real story isn't in comparing them to TSMC. What's critical now is each company's internal recalibration and its leadership's...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Thursday 31 October 2024
UMC sees falling fab utilization and gross margin in 4Q24
Pure-play foundry United Microelectronics (UMC) anticipates a decline in both its fab utilization rate and gross margin in the fourth quarter of 2024, and has lowered its capital...
Wednesday 30 October 2024
TSMC reportedly halts supply to two suspected Huawei proxies, challenges from China’s intermediary networks persist
According to informed sources, TSMC has suspended supplies to at least two chip developers due to suspicions that these companies are attempting to circumvent the US government's...
Wednesday 30 October 2024
Intel foundry: to split or not? Insights from Gelsinger and insiders
In March 2022, Intel CEO Pat Gelsinger was a guest at President Biden's State of the Union address, highlighting Intel's pivotal role in revitalizing semiconductor manufacturing in...
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...