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NEWS TAGGED IC DESIGN, DISTRIBUTION
Friday 12 September 2025
SEMICON Taiwan 2025: Broadcom eyes CPO expansion beyond AI scale-out data centers
Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
Friday 12 September 2025
Huawei, Cambricon AI chip production set to top one million units by 2026
China is accelerating its drive for homegrown AI semiconductors. JPMorgan forecasts Huawei will ship 600,000–650,000 AI chips in 2025, while Cambricon Technologies is on track...
Friday 12 September 2025
Huawei’s HiSilicon appoints new chairman after Eric Xu exit
Huawei Technologies senior executive Eric Xu has stepped down as the legal representative and chairman of subsidiary HiSilicon Semiconductor. He will be succeeded by Jeffrey Gao.
Friday 12 September 2025
Intel to continue semiconductor glass substrate commercialization despite market rumors
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Thursday 11 September 2025
Taiwan govt suggests AI boom as leverage in US Section 232 investigation
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
Thursday 11 September 2025
SEMICON Taiwan 2025: Taiwan's 10-year chip program seeks to link semiconductor supply chains among democratic countries
In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...
Thursday 11 September 2025
Shenzhen expo underscores integration of optoelectronics and semiconductors
The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...
Thursday 11 September 2025
SEMICON Taiwan 2025: Edge AI emerging as growth driver, scalability to determine future, says NXP CEO
In a keynote speech delivered at the SEMICON Taiwan 2025, NXP CEO Kurt Sievers stressed that AI has ushered the semiconductor industry into a period of exponential expansion. Addressing...
Thursday 11 September 2025
Samsung eyes xAI chip partnership following major Tesla deal
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Wednesday 10 September 2025
Google leads cloud AI race with advanced TPU chips, says industry insiders
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
Wednesday 10 September 2025
Highlights from China International Optoelectronic Expo and SEMI-e: sovereign AI, drones, AR/VR/MR in focus
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
Wednesday 10 September 2025
Nvidia unveils Rubin CPX GPU for massive-context AI, available end 2026
Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...
Wednesday 10 September 2025
NXP taps former TI China chief to steer Greater China amid rising competition
NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...