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NEWS TAGGED IC DESIGN, DISTRIBUTION
Thursday 11 September 2025
Samsung eyes xAI chip partnership following major Tesla deal
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Wednesday 10 September 2025
Google leads cloud AI race with advanced TPU chips, says industry insiders
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
Wednesday 10 September 2025
Highlights from China International Optoelectronic Expo and SEMI-e: sovereign AI, drones, AR/VR/MR in focus
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
Wednesday 10 September 2025
Nvidia unveils Rubin CPX GPU for massive-context AI, available end 2026
Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...
Wednesday 10 September 2025
NXP taps former TI China chief to steer Greater China amid rising competition
NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...
Tuesday 9 September 2025
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
Tuesday 9 September 2025
Over 50 Taiwan IC design houses compete for govt subsidies
The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...
Tuesday 9 September 2025
L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...
Tuesday 9 September 2025
Intel announces leadership changes to strengthen execution and accelerate innovation
Intel has announced a series of senior leadership appointments aimed at advancing its core product business, scaling its foundry operations, and reinforcing engineering capabilities...
Tuesday 9 September 2025
Apple to unveil new products in annual event as 5G modem chip strategy evolves
Apple's much-anticipated annual event is scheduled for September 10 at 1 a.m. Taiwan time, where several new products, including the iPhone series, Apple Watch, and AirPods Pro, are...
Tuesday 9 September 2025
Samsung's Exynos comeback aims for Qualcomm's mobile chip dominance
Samsung Electronics is reportedly expected to feature its in-house application processor (AP), the Exynos 2600, in the upcoming Galaxy S26 flagship series scheduled for early 2026...
Monday 8 September 2025
Exclusive: Broadcom secures US$10B ASIC win, Apple and xAI next in line
Broadcom delivered strong earnings guidance with its latest results, as CEO Hock Tan revealed a US$10 billion ASIC mass-production order from a major new customer outside the core...
Monday 8 September 2025
Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...