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Grand Opening of Wolfspeed Mohawk Valley 200mm SiC Fab
NEWS TAGGED IBM
Friday 11 September 2020
IBM Taiwan eyeing AI storage
IBM Taiwan expects its AI storage systems to benefit from the ongoing transformation of Taiwan's financial sector, Taiwanese manufacturers moving operations back home and the rapid...
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Wednesday 19 August 2020
IBM announces 7nm processor
IBM has revealed the next generation of its POWER central processing unit (CPU) family, designed for enterprise hybrid cloud computing.
Thursday 6 August 2020
Taiwan to see more cloud businesses shifted from Hong Kong
Taiwan is emerging as an increasingly important destination for international cloud service providers to set up new footholds as Hong Kong is losing luster in the sector due to China's...
Tuesday 9 June 2020
Digital transformation demand rising from manufacturing industry
With the coronavirus pandemic significantly impacting manufacturing operations, IBM has seen increasing demand from makers to help with their digital transformation, according to...
Monday 11 November 2019
Adlink, IBM Taiwan to help makers integrate IT, OT, AI
Industrial computing device maker Adlink Technology and IBM Taiwan have partnered to help Taiwan-based makers upgrade manufacturing processes to Industry 4.0 standards through integrating...
Friday 4 October 2019
Global server shipment forecast, 2020 and beyond
According to Digitimes Research's observation, the server market is experiencing sluggish growth in 2019 with customer inventory level running high. However, as inventory depletion...
Monday 12 August 2019
Software outsourcing to boom on 5G, AI applications in next decade, says Wistron ITS
The software outsourcing sector is promising in the next 10 years, driven by the ever-expanding 5G and AI applications, according to Wistron Information Technology & Services.
Wednesday 7 August 2019
IBM sees magnetic tapes as mainstream data storage media in next decade
While data volume will expand exponentially from proliferating 5G, IoT, and autonomous driving applications, magnetic tapes will remain the mainstream data storage medium in the next...
Monday 22 July 2019
ODMs relocating production lines urged to embrace smart manufacturing
Taiwan makers should consider automated production lines when relocating their plants, applying the Industry 4.0 concept into their facilities to enhance long-term competitiveness,...
Wednesday 17 July 2019
Japan export control to have limited impact on Samsung foundry biz
Japan's tighter export control on photoresists and two other critical materials used in South Korea's high-tech sector are unlikely to benefit TSMC much given the relatively small...
Wednesday 26 June 2019
Enterprise AI to be key growth driver: Q&A with IBM Greater China CTO Dong Xie
IBM has been looking to expand its presence in the cloud computing industry via the releases of its AI+ and the offering of hybrid cloud solutions, and expects enterprise AI to be...
Thursday 23 May 2019
IBM set to commercialize quantum computers in 3-5 years, says executive
IBM is set to commercialize its quantum computers in the next 3-5 years, when they can outperform existing supercomputers in terms of computing capability in some specific domains,...
Thursday 7 March 2019
PCB maker Unimicron boosts production efficiency by 70% with AI
PCB maker Unimicron Technology has seen its production efficiency improve by 70% after adopting AI solutions for product inspection through cooperating with IBM, according to company...
Wednesday 26 December 2018
Macronix, IBM extend partnership
Taiwan-based Macronix International has announced it will continue working with IBM to jointly develop phase-change memory and other new advanced technologies under a new agreement...
Thursday 27 March 2014
Nvidia NVLink technology
Nvidia has announced that it plans to integrate a high-speed interconnect, called NVLink into its future GPUs, enabling GPUs and CPUs to share data five to 12 times faster than they can today. This will eliminate a longstanding bottleneck and help pave the way for a new generation of exascale supercomputers that are 50-100 times faster than today's most powerful systems, the vendor said. Nvidia will add NVLink technology into its Pascal GPU architecture - expected to be introduced in 2016 - following Nvidia's new Maxwell compute architecture for 2013. The new interconnect was co-developed with IBM, which is incorporating it in future versions of its Power CPUs. With NVLink technology tightly coupling IBM Power CPUs with Nvidia Tesla GPUs, the Power data center ecosystem will be able to fully leverage GPU acceleration for a diverse set of applications, such as high performance computing, data analytics and machine learning. Today's GPUs are connected to x86-based CPUs through the PCI Express (PCIe) interface, which limits the GPU's ability to access the CPU memory system and is four- to five-times slower than typical CPU memory systems. PCIe is an even greater bottleneck between the GPU and IBM Power CPUs, which have more bandwidth than x86 CPUs. As the NVLink interface will match the bandwidth of typical CPU memory systems, it will enable GPUs to access CPU memory at its full bandwidth.
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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