Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be...
Huawei is stepping up purchases of IC substrates from its Taiwan-based suppliers, including Unimicron Technology and Nan Ya PCB, according to industry sources.
ABF substrates have seen robust demand for processing 5G networking chips and high-performance computing chips since the start of 2019, but shipments of BT substrates for mobile chips...
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Taiwan has been the leader in the global PCB sector in terms of production value and technology development, and China has grown rapidly to unseat Japan as the world's second largest...
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...
IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...
Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...
Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...
Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...
Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...
Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.
Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...
