Monday 28 June 2021
Intel, AMD, Nvidia in keen competition for ABF substrate capacity
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Thursday 3 June 2021
AT&S to set up ABF substrate production base in Southeast Asia
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
Tuesday 25 May 2021
IC substrate supply to stay constrained in 2021-2022
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Monday 3 May 2021
Taiwan IC substrate suppliers negotiating new deals with AMD
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Thursday 29 April 2021
Ibiden to expand high-end ABF substrate capacity
Ibiden has announced plans to inject JPY180 billion (US$1.66 billion) into the expansion of production capacity for high-end IC substrates for applications such as servers and image...
Tuesday 6 April 2021
PTI lands major SMT testing orders for Intel CPUs
Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...
Friday 26 March 2021
Semiconductor suppliers prepare for Intel Whitley
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Monday 8 March 2021
Tight ABF substrate supply may ease in 2023 at earliest
Tight supply for ABF substrates may ease in 2023 at the earliest if makers in Taiwan, Japan and Korea can smoothly commercialize their new capacity with stable yield rates in 2022...
Wednesday 3 March 2021
ABF substrates to be in short supply by at least 25% in 2021
The global supply of ABF substrates may fall short of demand by at least 25% in 2021, due mainly to limited capacity expansions despite increasing demand, according to industry sou...
Monday 19 October 2020
China PCB makers poised for new stage of competition with Taiwan peers
With Taiwan sustaining its firm leadership in the global PCB industry, China has been fast catching up due to its heavy capital expenses over the past five years, and PCB makers in...
Monday 19 October 2020
TSMC as top HPC foundry to benefit Taiwan ABF substrate vendors
TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...
Tuesday 18 August 2020
Daeduck to expand ABF substrate capacity for Samsung demand
Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...
Thursday 30 July 2020
Unimicron investing big in expanding ABF substrate capacity
Unimicron Technology's board of directors has resolved to allocate NT$17.4 billion (US$594.2 million) in capex for 2021, with over 90% of the sum and the majority of another budget...
Monday 27 July 2020
Zhen Ding, AT&S lead in SLP mainboard supply for iPhones, Apple Watch
SLP (substrate-like PCBs) makers in the supply chain of Apple devices have ended their first wave of competition, with Taiwan's Zhen Ding Technology and Austria's AT&S each absorbing...