Samsung reportedly to build additional ABF substrate capacity

Jay Liu and Jessica Tsai, Taipei; Jessie Shen, DIGITIMES Asia 0

Credit: unsplash

Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated at about KRW1 trillion (US$837.5 billion) in which...

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