Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...
High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...
Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...
South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...
China's leading DRAM maker CXMT has reportedly raised its DDR5 production yield above 90%, narrowing the gap with Samsung Electronics...
SK Hynix is restarting a long-frozen expansion of its Dalian, China, NAND flash plant, adding capacity that will lift output at the...