Samsung Electronics and SK Hynix are upgrading their NAND flash factories in China to make chips with more than 200 layers, Reuters reported on October 21, citing four people...
AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large...
Micron Technology's Taoyuan union has announced a one-day warning strike for October 22, coinciding with a second round of labour mediation between the company and its Taichung union...
Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position while China's...
SK Hynix, South Korea's industry ministry, the state-run Korea Trade Insurance Corp. (K-SURE), and four major commercial banks launched a KRW2 trillion (US$1.5 billion) loan guarantee...
SK Hynix has presented the Memory-Centric AI Rack System (MARS) at the Open Compute Project (OCP) Global Summit. The architecture separates memory from individual servers and pools...
Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic...
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
AI data center investment continues to expand, keeping the global memory market undersupplied in the fourth quarter of 2026. Rising DRAM and NAND Flash contract prices are boosting...
Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory...
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
