According to King Yuan Electronics (KYEC), the IC testing specialist is bullish about the AI and HPC chip market. The company anticipates an increase in testing volume in the second...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
Semiconductor probe card makers like Chunghwa Precision Test Tech (CHPT) are cautiously bullish about 2024's market prospects, counting on demand for HPC chips, application processors...
As the semiconductor industry goes through a downturn period due to the excessive orders during the pandemic and the subsequent inventory adjustment, WinWay Technology, a semiconductor...
The three primary high-performance computing (HPC) chip suppliers, Intel, AMD, and Nvidia, will likely see their sales strengthen quarter by quarter in the second half of 2023, buoyed...
SiFive, Inc., a pioneering force in RISC-V computing, has unveiled a pair of groundbreaking products to cater to the ever-growing demands of high-performance computing. The new SiFive...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
A surge in AI server chip demand cannot offset the overall slump in consumer electronics demand, causing TSMC to cut its revenue growth forecast for 2023 to a 10% drop. However, market...
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
With the rise of OpenAI's ChatGPT and Baidu's Ernie Bot, the prospects of the high-performance computing (HPC) chip market look good. However, the HPC chip delivery situation has...
WinWay Technology, a provider of IC test interface solutions, remains focused on high-performance computing (HPC) chip demand and has rolled out wafer-level co-packaged optics (CPO)...
High-performance computing (HPC) chip demand has been difficult for IC test interface solution vendors to predict, but they anticipate recovery could start in the second half of 20...
