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Friday 16 December 2022
IC test and verification labs see 3nm chip demand ramp up in 2024
IC test and verification labs are gearing up for a ramp-up in 3nm chip output in 2024, according to industry sources.
Thursday 20 October 2022
China still capable of developing edge AI chips
Despite the US' latest restrictions on exports of advanced-node chips and related manufacturing equipment to China, China will still be capable of developing its homegrown AI chips...
Tuesday 30 August 2022
Nvidia mulls TSMC SoIC tech in HPC chips
Nvidia is working closely with TSMC to manufacture its top-end processors, considering the adoption of the foundry's 3D SoIC (system on integrated chips) technology in its HPC chip...
Monday 8 August 2022
TSMC's future R&D initiatives revealed in VLSI Symposium
The world's largest semiconductor foundry service provider, TSMC, shared innovations beyond its current roadmaps to illustrate technology innovation at system and product level, and...
Monday 27 June 2022
Taiwan IC test supply chain gaining from HPC chip boom
Taiwan's suppliers of high-end IC test interface solutions are poised to enjoy growing HPC chip demand for AI, datacenter and server applications, particularly now that Chinese chipmakers...
Monday 20 June 2022
Taiwan backend partners gear up for new AMD, Nvidia HPC chips
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
Friday 10 June 2022
ASE gearing up for server, HPC chip boom
ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Research Report Database
Summary of Tech Supply Chain News!
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research