As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron...
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory...
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains...
Chipmaker Micron Technology Inc. said it will spend about US$200 billion on US manufacturing, research and development, the latest company to pledge large-scale investments in the...
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the...
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong brokerage...
The Trump administration has escalated its tech crackdown on China with a sweeping ban on Electronic Design Automation (EDA) software exports. On May 29, 2025, Synopsys, Cadence, and...
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready...
South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies...
