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HBM equipment race intensifies as newcomers battle for market entry

Cheng-Yu Jiang, Seoul; Emily Kuo, DIGITIMES Asia 0

Credit: Hanmi Semiconductor

Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current market leader, Hanmi Semiconductor, several Korean firms have also...

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