China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...

Shortage of automotive MCUs will remain on track to ease in 2022, but a new wave of uneven component supply will be emerging and may last till 2023 with core chips for ADAS to lead...

Holtek Semiconductor has no plans to raise its MCU and other consumer IC prices despite foundry costs continuing to rise, as Chinese peers are striving to win more orders for small...

Powertech Technology (PTI) is expected to post flat or slight sequential revenue growth in the fourth quarter of 2021, when the backend house will see demand for logic chips outperform...

Demand for wire-bonding packaging is likely to slow down in 2022 as backend houses have decided to defer installation of new wire-bonders that have reached them following long delivery...

Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...

Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...

Demand for games consoles continues to gain momentum amid persistent stay-at-home activities, allowing Sony Interactive Entertainment (SIE) to score big from the sales of its next-generation...

Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...

TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including 60...

Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...

First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...

OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...

Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous two...