90 news items tagged Greatek
IC packaging equipment in severely tight supply
Wednesday 14 April 2021The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...
Backend houses see order visibility for CIS, sensor chips through 4Q21
Friday 9 April 2021Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Backend firms see persistently strong demand for MCUs
Thursday 8 April 2021Backend firms including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE) continue to enjoy strong packaging demand for...
Prices for epoxy molding compounds to rise 10% in April
Wednesday 31 March 2021Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...
Wire-bonding capacity to sustain full utilization throughout 2021
Wednesday 24 March 2021IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
PTI to offer Renesas additional backend capacity support
Tuesday 23 March 2021Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Backend firms to gain growth momentum from car chips till 3Q21
Tuesday 16 March 2021Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Wednesday 3 March 2021Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Packaging quotes for MCU and other consumer ICs set to rise
Thursday 18 February 2021Packaging specialists, such as Greatek Electronics, plan to raise their quotes for MCU and other consumer IC products in the second quarter to reflect their tight capacities, according...
Backend firms upbeat about demand for MediaTek chips
Thursday 28 January 2021Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up...
Logic IC packager Greatek to raise quotes later in 1Q21
Wednesday 27 January 2021Greatek Electronics, a Powertech Technology (PTI) subsidiary dedicated to logic IC packaging, plans to raise its quotes between the end of February and the beginning of March to reflect...
Automotive chips vendors mull adopting FOPLP backend technology
Monday 18 January 2021Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
CWTC readies NT$10 billion for leadframe capacity expansions, acquisitions
Wednesday 23 December 2020Leadframe maker Chang Wah Technology (CWTC) has readied NT$10 billion (US$355.05 million) in new funds, including a 5-year syndicated loan of NT$7.2 billion (US$255.6 million) newly...
Taiwan OSAT firms see clear order visibility through mid-2021
Tuesday 22 December 2020Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
Taiwan backend houses see more demand for consumer power chips
Tuesday 15 December 2020Taiwan-based power IC backend specialists including Greatek Electronics, GEM Services and Lingsen Precision Industries have seen a ramp-up in packaging demand for consumer devices...
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Monday 14 December 2020Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Renesas seeking support from Taiwan OSAT for auto components
Tuesday 8 December 2020Japan-based IDM Renesas Electronics has been aggressively seeking support from its backend partners in Taiwan for next year to meet increasing demand for automotive MCUs and power...
Taiwan backend houses see orders boom
Monday 7 December 2020Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Taiwan backend firms, IC distributors to gain from fresh US ban on Chinese peers
Tuesday 1 December 2020The US Department of Commerce reportedly will place another 89 Chinese tech firms on its MEU (military end user) control list including JCET's subsidiary STATS ChipPAC and IC distributor...
ASE, Greatek see QFN wire bonding run at full capacity for PMICs
Friday 27 November 2020IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...
Taiwan supply chain bracing for new-generation game console boom
Thursday 12 November 2020Taiwan supply chain players are gearing up for the game console replacement boom to be triggered by Sony's new-generation game console PS5 and Microsoft's Xbox Series X, according...
Leadframe supplier CWTC posts profit increase
Tuesday 10 November 2020Chang Wah Technology (CWTC) has reported net profits rose 34% on year to NT$603 million (US$21.1 million) in the first three quarters of 2020, with EPS reaching NT$1.71 for the period,...
PTI eyes new logic IC orders from MediaTek, Novatek, Realtek
Monday 26 October 2020Memory backend specialist Powertech Technology (PTI) is aggressively foraying into new logic IC segments such as TV SoCs and handset APs in a bid to offset loss of orders expected...
Greatek to expand IC packaging capacity
Friday 23 October 2020IC packaging and testing service provider Greatek Electronics has plans to expand capacity to meet strong demand from the smaertphone sector.
Taiwan IC backend service firms ramping wire bonding capacity
Monday 19 October 2020The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog...