Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
Backend demand for 8-bit microcontroller units (MCU) will stay weak through the end of the year, while demand for 32-bit MCUs, as well as industrial and automotive MCUs, will remain...
Greatek Electronics, an affiliate of Powertech Technology (PTI) specializing in logic IC packaging, expects the backend packaging demand from its MCU clients to hit bottom in the...
Despite chipmakers' near-term caution about market prospects, semiconductor materials demand remains promising in the longer term, according to market sources.
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to...
Progate Group Corporation (PGC), which is among TSMC's design ecosystem partners, has expressed optimism about its operations in 2023 and will start to trade its shares on the Taipei...
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Powertech Technology (PTI) will be striving to keep its third-quarter revenue about on par with the second-quarter level amid volatile market conditions, according to the memory and...
Taiwan's leading OSATs ASE Technology and Powertech Technology (PTI) managed to score impressive revenue gains in the first half of 2022 and are expected to perform even better in...
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
