Taiwan's backend houses are relatively conservative about capex expansions, compared to foundry houses and fabless firms' eagerness in inceasing spending, according to industry sou...
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...
Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Backend firms including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE) continue to enjoy strong packaging demand for MCUs...
Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer chips,...
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Packaging specialists, such as Greatek Electronics, plan to raise their quotes for MCU and other consumer IC products in the second quarter to reflect their tight capacities, according...
Backend houses in the supply chain of MediaTek have expressed optimism about demand for the fabless client's 5G, Wi-Fi 6 and automotive chip solutions in 2021, and are ramping up capacity...
Greatek Electronics, a Powertech Technology (PTI) subsidiary dedicated to logic IC packaging, plans to raise its quotes between the end of February and the beginning of March to reflect...
Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
Leadframe maker Chang Wah Technology (CWTC) has readied NT$10 billion (US$355.05 million) in new funds, including a 5-year syndicated loan of NT$7.2 billion (US$255.6 million) newly...
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
